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Summary of Capabilities
- Min finished thickness D/S 003
- Min finished thickness M/L .010
- Max finished thickness up to 1.300
- Min I/L core thickness .002
- Min dielectric thickness .001
- Finished thickness tolerance +/- 10%
- Copper weights available (base/foil) 1/2,1, 2, 3, 4 oz
- Inner layer maximum Cu weight: 4oz
- Outer layer maximum CU weight: 6oz
- Minimum CU weight: ⅜oz
- Panel size: Max available panel size:24″ X 30″
- Lead free alternative High Tg laminates: – Polyclad FR-250HR (Tg = 150 C), PCL-FR-370HR (180 C), PCL-LD-621 (210 C)
- Teflon (Rogers, Taconic, Arlon, Nelco)
- Standard FR4, FR406, FR408, BT
- Polyimides
- GETEK
- 3000 series, 4000 series
- 5000 series, 6000 series
- Arlon material CuClad, DiClad, AD series
- Non-Woven and Woven PTFE
- RO4000 RO4350 TMM3 TMM4 TMM6 TMM10 TMM10I
- Woven PTFE
- 85 N- Pure Polyimide
- Ceramic Filled PTFE
- Non Woven PTFE
- IsoClad 900 Series
- Taconic Advanced Dielectric Division
- TLY TLX TLE TLC, TLT, RF-35
- RF Telecommunication (500 MHz to 100 GHz) Complex board shapes fabricated using CNC routing, milling Machining tolerances: ±.005″, down to ±.001″ Aluminum-backed PTFE circuit with nickel and gold plating on both copper circuitry and aluminum
- Single and double-sided circuits with thermally conducting electrically insulating bonding film (Thermasil) between circuitry and heat sink base. Copper circuitry with various Cu thicknesses and final finish can be bonded with Al of various types and thickness. For heat management applications: Power supplies, Automotive electronics including LEDs, Computers, Motor controls, and Power semiconductors
- Pre-CAM DRC Analysis
- CAM-controlled Panelization with DFM
- Extracted Net-list Comparison
- Max. Aspect Ration: 12 to 1
- Min. hole size tolerance (plated):+ .003″ Min hole size tolerance (unplated): +.0015″
- Min. drilled hole size: .008
- Maximum drilled hole size: 250 mil
- Min. annular plane clearance of drilled hole: .010″
- Min. internal pad size to drill hole size: +.012″
- Min. external pad size to drill hole size: +.010″
- Minimum core thickness: .002″
- Maximum layer count: 16
- Blind/buried vias – sequential lamination
- Scoring – CNC (jump scoring available); Web Routing: available
- Edge milling
- Hard-tool Pierce and /or Blank
- Edge beveling
- Minimum slot width: .020″
- Min. inside radius (milled): .015″
- Min. Distance of Plated Hole to internal Trace or Plane .0075″
- Min. Distance of Non-Plated Hole to internal Trace or Plane: Internal: .0075″, External .006″
- Standard finished Minimum Annular Ring is .001″, if not specified.
- Min. Pad to Drill Hole Size: Internal .010″, External .008″
- Min. Plane Clearance to Drill Hole: .020″
- Min. Drilled Hole Size: .008″
| Start Cu Foil | Internal | External |
| 0.5 oz. | .003" | .004" |
| 1.0 oz. | .004" | .006" |
| 2.0 oz. | .008" | .010" |
| 3.0 oz. | .010" | .012" |
| Start Cu Foil | Internal | External |
| 0.5 oz. | .003" | .004" |
| 1.0 oz. | .005" | .006" |
| 2.0 oz. | .006" | .0075" |
| 3.0 oz. | .008" | .010" |
- Min SMT pitch .012″
- Min I/L clearance to finished hole size .012″
- Min O/L pad to finished hole size .014″
- Registration tolerance (top to bottom) +/- .002″
- Soldermask registration tolerance +/- .0025″
- Min soldermask clearance .002″/Pad or SMT Feature
- Soldermask conductor overlap .003″ over conductor edge
- Min soldermask dam/web thickness .004″
- Min legend aperture .004″
- Min legend font height .007″
- Min distance from pad or SMT feature .005″
- SMOBC (Solder Mask Over Bare Copper)
- HASL – Hot Air Solder Level
- Lead Free Hot Air Level
- ENIG – Electroless Nickel / Immersion Gold
- ENEPIG
- Palladium- Electroless
- Hard Gold over Nickel Edge Connectors Nickel – Electrolytic
- Electrolytic Soft gold and Electrolytic Nickel
- Immersion Tin
- Immersion Silver
- Min SMT pitch .012″
- Min continuity 10 Ohm
- Min isolation 10 M Ohm
- Voltage range available 10-250 VDC
- Controlled impedance tolerance +/- 10%
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